The semiconductor chip is well recognized today for the fundamental revolution it brought to the advancement of electronics technology.
The semiconductor manufacturing process begins with one of the most common elements on earth, silicon. The silicon is refined to be virtually 100% pure, then molten and planted with silicon seed, and finally becomes an ingot which exactly mimics the physical characteristics of the original seed. The ingot is then cut into thin wafers for further processing.
Silicon is the base material for chips precisely because of the conductive properties related to its molecular structure. Under certain condition silicon will conduct electricity and under other conditions it does not. This is how semiconductor got its name.
In order to alter the characteristics of the semiconductor, numerous process steps are undertaken in various sequences depending on the complexity and functionality of the device,
1) Chemical vapor deposition (CVD) is a chemical process, where the wafer is exposed to one or more volatile precursors, which react and/or decompose on the wafer surface to produce the desired deposit;
2) Diffusion bakes impurities into areas of the wafer to alter its electrical characteristics.
In good cooperation with 48th Research Institute (Changsha) & 45th Research Institute (Beijing) of CETC since 2004, Xutemp has successfully developed, tested and patented its technologies and equipment for semiconductor process as follows,
1) Precision baths for MOCVD and Diffusion;
2) Ovens and heating cabinets for gas supply;
3) Chillers, refrigerating & heating circulators for chemical processing;
4) Refrigerated and heating test chambers for screening and reliability test.